捣筑的衬底

rammed bottom lining

沟道衬底隐埋异质结构激光器

channeled substrate buried heterostructure laser

衬底的温度

substrate temperature

衬底(杂质)扩散

диффузия примеси в подложку

衬底(表面)平行度

плоскопараллельность поверхностей подложки

衬底, 基片

нижний слой, подслой; подложка

一种微电子电路器件，其中的无源元件及内部金属连线直接在绝缘衬底上形成，然后再加上有源半导体器件（通常以大圆片形式给出）。

Microelectronic circuits in which the passive components and their metallic interconnections are formed directly on an insulating substrate and the active semiconductor devices(usually in wafer form) are added subsequently.